Electronic Equipment (Amendment) (No. 2) Regulations, 2006

Suppliment tal-Gazzetta tal-Gvern ta’ Malta, Nru. 17,975, 29 ta’ Settembru, 2006

L.N. 229 of 2006

PRODUCT SAFETY ACT

(CAP. 427)

Restriction of Use of Hazardous Substances in Electrical and

Electronic Equipment (Amendment) (No. 2) Regulations, 2006

IN exercise of the powers conferred by articles 38 to 40 of the

Product Safety Act, the Minister for Competitiveness and

Communications, on the advice of the Malta Standards Authority, has

made the following regulations>-

(1) The title of these regulations is the Restriction of Use of Citation.

Hazardous Substances in Electrical and Electronic Equipment

(Amendment) (No.2) Regulations, 2006 and they shall be read and

construed as one with the Restriction of Use of Hazardous Substances

in Electrical and Electronic Equipment Regulations, 2004, hereinafter L.N. 396 of 2004.

referred to as “the principal regulations”.

(2) These regulations shall apply from the 1st July 2006.

(3) These regulations implement the requirements of

Commission Decision 2006#310#EC of 21 April 2006 amending, for

the purposes of adapting to the technical progress, the Annex to Directive

2002#95#EC of the European Parliament and of the Council as regards

exemptions for applications of lead.

For Schedule I of the principal regulations there shall be

substituted the following>

“SCHEDULE I

(Regulation 4(2))

Applications of lead, mercury, cadmium, hexavalent chromium,

polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)

which are exempt from the requirements of regulation 4(2)

Application

Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

1. Mercury in straight fluorescent lamps for general purposes not exceeding>

2. – halophosphate

10 mg

– triphosphate with normal lifetime

5 mg

– triphosphate with long lifetime

8 mg.

Mercury in straight fluorescent lamps for special purposes.

Mercury in other lamps not specifically mentioned in this Schedule.

4.

Lead in glass of cathode ray tubes, electronic components and fluorescent

Lead as an alloying element in steel containing up to 0.35 % lead by weight,

aluminium containing up to 0.4 % lead by weight and as a copper alloy containing up

to 4 % lead by weight.

(a) Lead in high melting temperature type solders (i.e. tin-lead solder alloys

containing more than 85 % lead),

(b) Lead in solders for servers, storage and storage array systems, network

infrastructure equipment for switching, signaling, transmission as well as network

management for telecommunications,

(c) Lead in electronic ceramic parts (e.g. piezoelectronic devices).

Cadmium and its compounds in electrical contacts and cadmium plating except

for applications banned under Directive 91#338#EEC 3 amending Directive 76#769#EEC 4

relating to restrictions on the marketing and use of certain dangerous substances and

preparations.

OJ L 186, 12.7.1991, p. 59.

OJ L 262, 27.9.1976, p. 201.

Item

Application

No.

Hexavalent chromium as an anti-corrosion of the carbon steel cooling system

in absorption refrigerators.

Deca BDE for polymeric applications.

9a.

9b. Lead in lead-bronze bearing shells and bushes.

____

Lead used in compliant pin connector systems.

Lead as a coating material for the thermal conduction module c-ring.

Lead and cadmium in optical and filter glass.

13.

Lead in solders consisting of more than two elements for the connection

between the pins and the package of microprocessors with a lead content of more than

80 % and less than 85 % by weight.

Lead in solders to complete a viable electrical connection between

semiconductor die and carrier within integrated circuit Flip Chip packages.

Lead in linear incandescent lamps with silicate coated tubes.

16.

Lead halide as radiant agent in High Intensity Discharge (HID) lamps used

for professional reprography applications.

Lead as activator in the fluorescent powder (1 % lead by weight or less) of

discharge lamps when used as sun tanning lamps containing phosphors such as BSP

(BaSi2O5>Pb) as well as when used as speciality lamps for diazo-printing reprography,

lithography, insect traps, photochemical and curing processes containing phosphors

such as SMS ((Sr,Ba)2MgSi2O7>Pb).

Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main

amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving

Lamps (ESL).

Lead oxide in glass used for bonding front and rear substrates of flat

fluorescent lamps used for Liquid Crystal Displays (LCD).”.

Mitbug[ fl-Istamperija tal-Gvern — Printed at the Government Printing Press